At 9:48 a.m. on October 20, the completion and operation ceremony of the Active Netal Brazing carrier plate project of Jiangsu(Ferrotec) Semiconductor Technology Co., Ltd. was held in Dongtai, Jiangsu high tech Industrial Development Zone.
Mr. Wang Xudong, deputy secretary of Dongtai municipal Party committee and mayor of Dongtai Municipal People's government, Mr. Xu Yue, deputy mayor of Dongtai Municipal People's government, Mr. Wang Xiaofeng, Secretary of the Party Working Committee of Dongtai high tech Industrial Development Zone, Mr. Ding Jindong, director of the Management Committee of Dongtai high tech Industrial Development Zone, deputy president of suppression service and Ferrotec (China) board of directors on behalf of Japan Magnetic Technology Holding Co., Ltd Mr. He Xianhan, chairman of Jiangsu (Ferrotec）Semiconductor Technology Co., Ltd., Mr. Yan Ji, deputy general manager of CRRC times Semiconductor Co., Ltd., Mr. Guo Jianyue, general manager of Shanghai Shenhe thermo-magnetic Electronics Co., Ltd., Mr. Zhang Enrong, general manager of Jiangsu （Ferrotec) Semiconductor Technology Co., Ltd. and other leaders attended the ceremony, with more than 130 representatives of suppliers, customers and employees jointly witnessing the ceremony of this grand moment.
Mr. Zhang Enrong, general manager of Jiangsu (Ferrotec) Semiconductor Technology Co., Ltd., first introduced the production of AMB project. Mr. Yan Ji, deputy general manager of CRRC times Semiconductor Co., Ltd., delivered a speech as a customer representative. He Xianhan, deputy president of Japan Magnetic Technology Holding Co., Ltd., chairman of Ferrotec (China) board of directors and chairman of Jiangsu (Ferrotec) Semiconductor Technology Co., Ltd Mr. He delivered an inspiring speech, and Mr. Wang Xudong, deputy secretary of Dongtai Municipal Committee and mayor of Dongtai Municipal People's government, delivered a passionate and important speech.
After the ceremony, president He led guests from all walks of life to visit the production workshop of AMB project and introduce the advanced equipment in detail. At the end of the visit, Xu Yue, vice mayor of Dongtai municipal government and leaders of economic development zone held friendly talks with Ferrotec group leaders and some business representatives.
Project introduction
This project is a mass production technology accumulation rich in the manufacturing of DCB copper-clad ceramic base plate. In recent years, it has introduced domestic and foreign senior experts and technical talents and continuously increased the R & D investment. The project has invested 150 million yuan, gradually built a production line with an annual output of 2.4 million AMB plates, and the annual sales volume is 600-700 million yuan.
The successful implementation of the project fills the gap in China and takes the lead in realizing mass production in the world, which greatly improves the competitiveness of China's semiconductor power module device industry in the world. Compared with the traditional DCB copper-clad ceramic substrate, the AMB active metal brazing substrate has higher reliability, stronger mechanical properties, better insulation performance, and a good matching thermal expansion coefficient with the chip. It has become the first choice packaging material for the third generation semiconductor and new high-voltage and high-power power electronic devices, and has a broad application prospect. The silicon nitride AMB carrier plate developed by Ferrotec has the characteristics of high precision of graphic forming, high reliability and low sensitivity of electrochemical migration; the aluminum nitride AMB base plate developed by Ferrotec has achieved good welding of aluminum nitride and copper, with low void ratio and small residual stress in the product interface. All the performance indexes of the two products have reached the international advanced level, and have been widely recognized by well-known enterprises at home and abroad Good market prospect.